Immersion cooling apparatus

ABSTRACT

A device for cooling a heat-dissipating component comprising a body having at least one sidewall, an enclosed volume, an expansion volume, a quantity of heat transfer fluid disposed within the enclosed volume, and means for releasing the heat transfer fluid from the enclosed volume to the expansion volume. Upon release into the expansion volume, the heat transfer fluid can contact the heat-dissipating device.

BACKGROUND

As electronic systems become more compact, there is a continuing desireto increase the rate of heat transfer away from heat-dissipatingcomponents. Air or water-cooled heat sinks can be affixed to theheat-dissipating component to help cool the heat-dissipating component.Often, a thermal interface material is used at the interface between theheat sink and the heat-dissipating component. The thermal resistance ofthe thermal interface material can contribute significantly to theoverall thermal resistance between the heat-dissipating component andthe environment.

Immersion cooling, in which the heat-dissipating component is immerseddirectly in a heat transfer fluid, provides certain advantages incooling heat-dissipating components. Immersion cooling, for example,allows the thermal interface material to be eliminated.

Although liquid immersion heat transfer techniques have been used inlarger scale electronic systems, the use of liquid immersion heattransfer techniques in small electronic devices, such as, for example,personal computers has been limited. Immersion cooling systems typicallyrequire complex hardware and complicated sealing and degassingoperations to assemble. There is a continuing need to provideinexpensive immersion cooling components that can be easily installed ina manufacturing process or by an end-user.

SUMMARY

The present invention relates generally to a device for coolingelectronic components, and more particularly, to a device for immersingan electronic component in a cooling fluid. In one aspect, the presentinvention provides an inexpensive device for immersing aheat-dissipating component. The device can be installed easily in amanufacturing process or by an end-user.

In one aspect, the present invention provides a device for cooling aheat-dissipating component comprising a body comprising at least onesidewall and a breachable seal cooperating to define an enclosed volume.The breachable seal has an inner surface proximate the enclosed volumeand an outer surface. A quantity of heat transfer fluid is disposedwithin the enclosed volume. In some embodiments, the article comprises ameans for breaching the seal such that the heat transfer fluid isallowed to contact the heat-dissipating component.

In some embodiments, the heat transfer fluid comprises at least one of aperfluorocarbon, hydrofluorocarbon, hydrofluoroether, andperfluoroketone. In certain embodiments, the breachable seal comprisesat least one of a polymer film, a metal foil, and a multilayer barrierfilm. The breachable seal can have a burst strength that is less thanthe sidewall. In some embodiments, the sidewall comprises at least oneof a polymer film, a metal foil, and a multilayer barrier film.

In some embodiments, a puncturing member comprising a striking surfaceis used to breach the breachable seal. The striking surface can bepositioned within the enclosed volume. In some embodiments, the strikingsurface is positioned proximate the outer surface of the breachableseal.

In some embodiments, the breachable seal is affixed to the sidewall. Inother embodiments, the breachable seal is removable.

In some embodiments, a reactive metal is positioned within the enclosedvolume to scavenge oxygen. In certain embodiments, an adsorbent ispositioned within the enclosed volume.

An attachment interface or other attachment means can be used to affixthe body to a substrate or a heat-dissipating device. Some embodimentsalso include a boiling enhancement and a thermal interface material.

In some embodiments, the device is used as a thermosyphon, as part of alarger cooling system, or as a component in a computer.

The present invention also provides an article for cooling aheat-dissipating component comprising a body having at least onesidewall, an enclosed volume, an expansion volume, a quantity of heattransfer fluid disposed within the enclosed volume, and means forreleasing the heat transfer fluid from the enclosed volume to theexpansion volume. Upon release into the expansion volume, the heattransfer fluid can contact the heat-dissipating device.

The present invention also provides methods for installing an articlefor cooling a heat-dissipating component. The method includes affixing abody to a substrate supporting a heat-dissipating component. The bodycomprising at least one sidewall and a breachable seal cooperating todefine an enclosed volume, and a quantity of heat transfer fluiddisposed within the enclosed volume. After affixing the body, the sealis breached to allow the heat transfer fluid to contact theheat-dissipating component.

The term “breachable seal” refers to a material that can be broken,ruptured, torn, or removed through an application of manual forcewithout damaging adjacent components. The manual force may be applied toan instrument, such as, for example, a puncturing member or pull tab, tobreak, rupture, tear, or remove the seal.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a perspective view of an exemplary embodiment of the presentinvention positioned on a substrate;

FIG. 2 is a cross-sectional view along sectional lines A-A of theexemplary embodiment shown in FIG. 1 prior to placement on the substrateand breaching of the seal;

FIG. 3 is a cross-sectional view along sectional lines A-A of theexemplary embodiment shown in FIG. 1 after placement on the substrateand breaching of the seal;

FIG. 4 is a cross-sectional view of an exemplary embodiment of thepresent invention having a puncturing member within a spacing member;

FIG. 5 is a cross-sectional view of an exemplary embodiment of thepresent invention having a puncturing member within the enclosed volume;

FIG. 6A is a cross-sectional view of an exemplary embodiment of thepresent invention having a tether within the enclosed volume and aspring member to attach a boiling enhancement;

FIG. 6B is a cross-sectional view of the exemplary embodiment shown inFIG. 6A after attachment to a substrate and breaching of the seal;

FIG. 7A is a cross-sectional view of an exemplary embodiment of thepresent invention having a flexible sidewall; and

FIG. 7B is a cross-sectional view of the exemplary embodiment shown inFIG. 7A after attachment to a substrate and breaching of the seal.

These figures, which are idealized, are not to scale and are intended tobe merely illustrative of the present invention and non-limiting.

DETAILED DESCRIPTION

FIG. 1 shows a perspective view of an exemplary embodiment of thepresent invention positioned on a substrate. As shown in FIG. 1, a body10 is affixed to a substrate 12. The body 10 has an internal volume thatcontains a heat transfer fluid that is in contact with aheat-dissipating component (not shown) affixed to the substrate 12. Insome embodiments, the body 10 is affixed directly to theheat-dissipating component.

In some embodiments, fluid conduits 13 can be connected to body 10 suchthat the heat transfer fluid within body 10 is in fluid communicationwith other cooling components, such as, for example, a condenser or heatexchanger. The conduits 13 can be tubular as shown in FIG. 1.Alternatively, the conduits can be any shape or configuration known tothose skilled in the art, including, for example, square, rectangular,or oval.

In other embodiments, the heat transfer fluid within body 10 is not influid connection with external cooling components. In such embodiments,body 10 can act as a thermosyphon by having a first region thatfunctions as an evaporator and a second region that functions as acondenser. In such an embodiment, the body can have an expandablesidewall such that the pressure within the body remains substantiallyconstant during operation.

FIG. 2 is a cross-sectional view along sectional lines A-A of theexemplary embodiment shown in FIG. 1 prior to placement on the substrateand breaching of the seal. As shown in FIG. 2, the body 10 has asidewall 14 and a breachable seal 18. The sidewall 10 and breachableseal 14 cooperate to define an enclosed volume 28 and an expansionvolume 29. A quantity of heat transfer fluid 16 is disposed within theenclosed volume 28.

Also shown in FIG. 2 is attachment interface 20. The attachmentinterface 20 can be used to affix the body 10 to a substrate. Theattachment interface 20 can also be used to form a seal between the body10 and the substrate to prevent fluid leakage. The attachment interface20 can be an adhesive tape, sealant, glue, elastomeric gasket, O-ring,or any other material known by those skilled in the art to create aneffective seal for retaining fluids.

Alternatively, the body 10 can be affixed directly to the substrate orheat-dissipating device without an attachment interface 20. For example,welding or using a mechanical clamp can affix the body 10 directly tothe substrate. In some embodiments, a mechanical fastener is used toaffix the body 10 to the substrate.

FIG. 3 is a cross-sectional view along sectional lines A-A of theexemplary embodiment shown in FIG. 1 after placement on a substrate 12and breaching of the seal. As shown in FIG. 3, the heat transfer fluid16 is contained within the enclosed volume 28 and expansion volume. Theheat transfer fluid 16 contacts a boiling enhancement 22 affixed to aheat-dissipating component 26. A thermal interface material 24 ispositioned between the boiling enhancement 22 and the heat-dissipatingcomponent 26. In alternate embodiments, the boiling enhancement 22 andthermal interface material 24 are not present.

The sidewall 14 can be rigid, flexible, or a combination of rigid andflexible materials. Materials suitable for use as a sidewall include,for example, metal, glass, ceramic, plastic, polymeric films, andmultilayer barrier films such as those commonly used in food packaging,particularly those lined with a polyamide or polyimide.

The term multilayer barrier film refers to any combination of metal,plastic, or cellulosic layers (e.g., foils, films, and paper). Thecombination of metal, plastic, or cellulosic layers can include multiplelayers of different materials, such as, for example, a metal combinedwith a plastic layer. The combination of metal, plastic, or cellulosiclayers can also include multiple layers of similar materials, such as,for example, two layers of plastic.

Multilayer barrier films useful in the present invention includemultilayer films with layers that are affixed to one another, forexample, by coating, laminating, coextrusion, or deposition. Multilayerbarrier films useful in the present invention can comprise layers oflow-density polyethylene, high-density polyethylene, polypropylene,polyester, nylon, polyethylene-co-vinyl acetate, polyvinylidenechloride, polyamide, or polyimide. In some embodiments, a multilayerbarrier composite having a layer of metal, such as, for example,aluminum is used. Multilayer barrier films and other films useful forthe sidewall of the present invention are described in U.S. Pat. Nos.4,997,032 (Danielson et al.) and 5,411,077 (Tousignant), incorporated byreference.

In certain embodiments, the sidewall is made from at least one ofstamped metal, machined metal, and plastics such as, for example,polycarbonate, nylon, acrylic, acrylonitrile butadiene styrene (“ABS”),phenolics, polyolefin, polyurethanes, polyphenylene sulfide, andpolyarylether ketones such as polyetheretherketone (“PEEK”).

In some embodiments, the sidewall selected is a dielectric to protectadjacent electronics. In certain embodiments, the sidewall material isselected, at least in part, based on the thermal gradient across thematerial. In some embodiments, the sidewall material is selected, atleast in part, based on the air permeability of the material. In certainembodiments, at least a portion of the sidewall is substantiallytransparent such that it is possible to visually inspect the enclosedvolume. A substantially transparent sidewall can also be used to enhancethe visual appearance of the body. In some embodiments, the sidewallmaterial is a non-flammable material.

In some embodiments, the sidewall is flexible such that the internalpressure of the body can be kept substantially constant as the heat fluxfrom the heat-dissipating device varies. In other embodiments, thesidewall is rigid and the internal pressure does not remain constantover the operating temperature range of the heat-dissipating device. Inyet further embodiments, the sidewall is rigid and the internal pressureof the body can be kept substantially constant as the heat flux from theheat-dissipating device varies by attaching a flexible member to thebody 10 via conduit 13.

Materials that can be punctured, ruptured, torn, or easily removed canbe used for the breachable seal including, for example, polymer film, ametal foil, or a multilayer barrier film. In certain embodiments, thebreachable seal is made from a material that has low gas permeability.In some embodiments, the burst strength of the material used forbreachable seal is less than the burst strength of the material used forthe sidewall.

In some embodiments, the body is packaged in a sealed multilayer barrierfilm. The multilayer barrier film allows the body to be packaged in anenvironment with a minimum amount of undesirable gases. In someembodiments, the multilayer barrier film is filled with an inert gas orsubstantially evacuated prior to sealing the body in the package. Bypackaging the body in a substantially inert environment, a breachableseal with a higher gas permeability can be used without allowing asubstantial amount of unwanted gases to enter the enclosed volume of thebody. In such an embodiment, the breachable seal can be made from a thinpolymer film that can be easily breached.

The heat transfer fluid useful in the present invention can be any fluidcapable of transferring heat, including water, air, volatile fluids,such as, for example, alcohols, and electronic cooling fluids known tothose skilled in the art. In certain embodiments, the heat transferfluid is dielectric, non-flammable, and provides a significant vaporpressure at the operating temperature of the heat-dissipating component.

In certain embodiments, the heat transfer fluid is thermally conductive,chemically inert, essentially gas-free, and thermally stable. In otherembodiments, the heat transfer fluid has a boiling point that is at orbelow the operating temperature of the heat-dissipating component suchthat portions of the liquid adjacent the heat-dissipating component willvaporize when conducting heat. The heat transfer fluid can be selectedfrom the representative class of fluorinated linear, branched or cyclicalkanes, ethers, ketones, tertiary amines, and aminoethers, and mixturesthereof. In some embodiments, perfluorinated fluids are used in thisinvention, though partially fluorinated fluids can also be used. Theperfluorinated fluids can be straight chain, branched chain, cyclic, ora combination thereof. In some embodiments, the perfluorinated fluidscan be saturated, that is, free of ethylenic, acetylenic, and aromaticunsaturation. The skeletal chain can include catenary oxygen and/ortrivalent nitrogen heteroatoms providing stable links betweenfluorocarbon groups and not interfering with the inert character of thecompound. In some embodiments, hydrofluoroethers, either segregated ornon-segregated are used. In other embodiments, perfluorinated ketonesare used.

Representative examples of suitable fluorinated fluids or mixturesthereof useful for the present invention are commercially available from3M Company, St. Paul, Minn., and marketed under various tradedesignations, including, for example, “3M BRAND FLUORINERT ELECTRONICLIQUIDS” and “3M BRAND NOVEC ENGINEERED FLUIDS”, described in 3M Companyproduct bulletin No. 98-0212-2249-7, issued January 2003. Othercommercially available fluorochemicals useful in the present inventionare those available from Solvay Solexis S.p.A, Bollate, Italy, under thetrade designation “GALDEN PFPE: HEAT TRANSFER FLUIDS” and theirhydrofluoroethers available under the trade designation “H-GALDEN ZTHEAT TRANSFER FLUID”. Heat transfer fluids useful in the presentinvention also include hydrofluorocarbon compounds such as those soldunder the trade designations “VERTREL SPECIALTY FLUIDS” and “SUVAREFRIGERANTS” available from DuPont, Wilmington, Del.

Illustrative examples of suitable boiling enhancements include, forexample, carbon foam, a heat spreader such as, for example, a flatplate, pin fin array, an array of channels, or other three-dimensionalstructures made of thermally conductive metal or composite material thatincreases surface area for boiling. These enhancements may be furtherenhanced by the application of a microporous coating, modulatedmicroreplicated features, or capillary structures that enhance boilingheat transfer by aiding nucleation or impeding the hydrodynamicmechanisms that lead to surface dry out. In another embodiment, theboiling enhancement is a coating applied to the heat-dissipatingcomponent 26 and no thermal interface material 24 is present.

The thermal interface material 24 can be solder or any conventionalthermal compound commonly known in the art. In certain embodiments, thethermal interface material is a low melting point eutectic alloy, suchas, for example, a eutectic alloy based upon indium that will remainliquid at the operating temperature of the thermal interface material.Such materials are desirable from a performance standpoint but arenormally subject to oxidation when exposed to air in their molten state.The closed environment created by the present invention can be used tocontrol the exposure level of thermal interface materials to oxygen suchthat the level of oxidation is minimized.

The heat dissipating component 26 can be a semiconductor, such as, forexample, a central or graphics processing unit, an insulated gatebipolar transistor (IGBT), memory module, or an application specificintegrated circuit (ASIC). In other embodiments, the heat dissipatingcomponent 24 can be a hard disk drive, power supply, transformer, laserdiode array, light emitting diode (LED) array, halogen bulb, or anyother heat-dissipating component known to those skilled in the art. Theheat dissipating component can also be a non-heat generating structure,such as, for example, an integrated heat spreader (IHS) that isconnected to a heat-generating device, such as, for example, asemiconductor.

FIG. 4 is a cross-sectional view of an exemplary embodiment of thepresent invention having a puncturing member 430 within an optionalspacing member 417. The spacing member 417 can be integrally formed withthe sidewall 414 or can be affixed to the sidewall 414. In someembodiments, the spacing member 414 is made of a different material thanthe sidewall 414. For example, the spacing member 414 can be made of amore rigid material to facilitate a better seal between the body 410 anda substrate. Likewise, the sidewall 414 can be made of a more flexiblematerial to facilitate pressure fluctuations within the enclosed volume428 or to facilitate breaching of the seal 418.

As shown in FIG. 4, the puncturing member 430 has a striking surface432. In certain embodiments, the striking surface 432 forms a point. Thepuncturing member 430 can be positioned so that distal end 433 extendsbeyond the lower surface 419 of the spacing member 417. During placementof the body 410 onto a substrate, the distal end 433 contacts thesubstrate and causes the puncturing member 430 to move relative to theseal 418 such that the striking surface 432 contacts and punctures theseal 418 causing the enclosed volume 428 to join the expansion volume429.

In some embodiments, the distal end 433 extends beyond the attachmentinterface 420 such that the distal end 433 is the first element tocontact the substrate during attachment of the body 410. In suchembodiments, the body 410 may be inverted during attachment to preventthe heat transfer fluid 416 from entering the expansion volume 429 andpotentially spilling.

In other embodiments, the distal end is positioned approximately flushwith or below the attachment interface 420. In such embodiments, theattachment interface 420 or spacing member 417 can be made from acompressible material. Compression of either the attachment interface420 or spacing member 417 by placing a force on the body 410 will causethe puncturing member 430 to move relative to the seal 418 such that thestriking surface 432 contacts and punctures the seal 418 causing theenclosed volume 428 to join the expansion volume 429.

FIG. 5 is a cross-sectional view of an exemplary embodiment of thepresent invention having a puncturing member 530 within the enclosedvolume 528. The puncturing member 530 has a striking surface 532 and adistal end 533. By applying a force to the distal end 533, the strikingsurface 532 will contact and puncture the seal 518 causing the enclosedvolume 528 to join the expansion volume 529. A puncturing member seal531 at the sidewall 514 prevents the heat transfer fluid 516 fromescaping through the sidewall 514. In another embodiment, the distal endof the puncturing member is affixed to the inner surface of the sidewalland does not extend through or beyond the sidewall. In such embodiment,a force upon the sidewall causes the sidewall to flex thus moving thepuncturing member toward the breachable seal 518 and breaching the seal518.

FIG. 6A is a cross-sectional view of an exemplary embodiment of thepresent invention having a tether within the enclosed volume and aspring member to attach a boiling enhancement. FIG. 6B is across-sectional view of the exemplary embodiment shown in FIG. 6A afterattachment to a substrate and breaching of the seal. As shown in FIGS.6A and 6B, a tether 640 can be used to cause the seal 618 to bebreached. A first end of the tether 640 is affixed to the breachableseal and the second end of the tether can be affixed to the sidewall614. As shown in FIG. 6B, the body can be deformed, either temporarilyor permanently, causing the tether 60 to breach the seal 618.Alternatively, the tether 640 can extend through the sidewall such thatit can be pulled manually outside of the body 610.

Other techniques for breaching an internal seal known to those skilledin the art can also be employed. For example, in other embodiments, thebreachable seal extends through the sidewall and can be breached orremoved by manually grasping and pulling a tab connected to the sealfrom outside of the body. In yet further embodiments, the burst strengthof the breachable seal is sufficiently low such that pressure applied tothe body causes the pressure in the enclosed volume to increase andrupture the breachable seal.

Also shown in FIGS. 6A and 6B is an embodiment that uses a retainingclip 642 to affix a boiling enhancement 622 to the body 610. A thermalinterface material 624 can be affixed to the boiling enhancement 622.The retaining clip is used to facilitate placement of a boilingenhancement on a heat-dissipating device 626 affixed to a substrate 612.In some embodiments, the retaining clip is made of a resilient butflexible material such that boiling enhancement 622 and thermalinterface material 624 can move relative to the body 610. The retainingclips can be made from metal, plastic, or any other material useful forattaching components known to those skilled in the art.

Body 10 can also contain small amount of reactive metal, 652, such asactivated nickel intended to scavenge oxygen that might be inside body10 at the time of manufacture or that might enter at the time the deviceis installed. Body 10 can also contain small amount of adsorbent, 650,such as activated carbon or other suitable material intended to scavengeless volatile materials, such as, for example, low molecular weightpolymers, UV stabilizers, or plasticizers that might over time beextracted from the materials in contact with the fluid and be depositedat the boiling surface disrupting performance.

FIG. 7 is a cross-sectional view of an exemplary embodiment of thepresent invention having a flexible sidewall. As shown in FIG. 7, thebody 710 can have a flexible sidewall 714 affixed to a spacing member717 using a flange 744. In some embodiments, the flexible sidewall 714comprises at least two substantially planar sheets of material that arebonded to one another at their periphery to form a seal 715. In such anembodiment, the sidewall 714 can comprise heat-sealable films that canbe thermally bonded to one another. In yet further embodiments, theheat-sealable films can be thermally bonded to the flange 744. In otherembodiments, the sidewall 714 is affixed to the spacing member 717 usingany means known to those skilled in the art, including, for example,adhesive and mechanical fasteners.

The attachment interface 720 is used to connect the body 710 to asubstrate or heat-dissipating component. The enclosed volume 728 andexpansion volume 729 are connected by breaching the breachable seal 718and allowing the heat transfer fluid 716 to flow into the expansionvolume 729. The breachable seal 718 can be breached using any of themethods described above. In certain embodiments having a flexiblesidewall such as body 710, the breachable seal 718 is ruptured byincreasing the pressure in the enclosed volume 728. The pressure can beincreased by manually squeezing the flexible sidewall 714 of the body710.

FIG. 7B is a cross-sectional view of the exemplary embodiment shown inFIG. 7A after attachment to a substrate and breaching of the seal. Asshown in FIG. 7B, the body 710 is affixed to substrate 712 usingattachment interface 720. A heat-dissipating component 726, such as, forexample, a central processing unit, is affixed to the substrate 712. Aboiling enhancement 722, such as, for example, a microporous coating, isapplied to the heating dissipating component 726. After the breachableseal 718 is removed or broken, the heat transfer fluid 716 is allowed toenter the expansion volume 729 and contact the boiling enhancement 722.

It is to be understood that even in the numerous characteristics andadvantages of the present invention set forth in above description andexamples, together with details of the structure and function of theinvention, the disclosure is illustrative only. Changes can be made todetail, especially in matters of shape, size and arrangement of thebreachable seal and sidewall and methods of use within the principles ofthe invention to the full extent indicated by the meaning of the termsin which the appended claims are expressed and the equivalents of thosestructures and methods.

1. An article for cooling a heat-dissipating component comprising: abody comprising at least one sidewall and a breachable seal cooperatingto define an enclosed volume, said breachable seal having an innersurface proximate said enclosed volume and an outer surface; and aquantity of heat transfer fluid disposed within said enclosed volume. 2.The article of claim 1 wherein said heat transfer fluid comprises atleast one of a perfluorocarbon, hydrofluorocarbon, hydrofluoroether, andperfluoroketone.
 3. The article of claim 1 wherein said breachable sealcomprises at least one of a polymer film, a metal foil, and a multilayerbarrier film.
 4. The article of claim 3 wherein said breachable sealcomprises a burst strength that is less than said sidewall.
 5. Thearticle of claim 1 wherein said sidewall comprises at least one of apolymer film, a metal foil, and a multilayer barrier film.
 6. Thearticle of claim 5 wherein at least a portion of said sidewall issubstantially transparent.
 7. The article of claim 1 further comprisingat least one puncturing member comprising a striking surface.
 8. Thearticle of claim 7 wherein said striking surface is positioned withinsaid enclosed volume.
 9. The article of claim 7 wherein said strikingsurface is positioned proximate said outer surface of said breachableseal.
 10. The article of claim 1 wherein said breachable seal is affixedto said sidewall.
 11. The article of claim 1 wherein said breachableseal is removable.
 12. The article of claim 1 further comprising atleast one tether having one end affixed to said seal.
 13. The article ofclaim 1 further comprising a means for breaching said seal.
 14. Thearticle of claim 1 further comprising a reactive metal positioned withinsaid enclosed volume.
 15. The article of claim 1 further comprising anadsorbent positioned within said enclosed volume.
 16. The article ofclaim 1 further comprising an attachment interface to affix said body toa substrate or heat-dissipating component.
 17. The article of claim 1further comprising an attachment means to affix said body to a substrateor heat-dissipating component.
 18. The article of claim 1 furthercomprising a boiling enhancement comprising at least one of carbon foamand a microporous coating.
 19. The article of claim 18 furthercomprising a thermal interface material affixed to at least a portion ofsaid boiling enhancement.
 20. The article of claim 19 wherein saidthermal interface material comprises a eutectic alloy.
 21. The articleof claim 1 further comprising a boiling enhancement affixed to said bodyby a retaining clip.
 22. A thermosyphon comprising an article accordingto claim
 1. 23. A cooling system comprising an article according toclaim
 1. 24. A computer comprising an article according to claim
 1. 25.An article for cooling a heat-dissipating component comprising a bodyhaving at least one sidewall, an enclosed volume, an expansion volume, aquantity of heat transfer fluid disposed within said enclosed volume,and means for releasing said heat transfer fluid from said enclosedvolume to said expansion volume.
 26. The article of claim 25 whereinsaid heat transfer fluid comprises at least one of a perfluorocarbon,hydrofluorocarbon, hydrofluoroether, and perfluoroketone.
 27. Thearticle of claim 25 wherein said sidewall comprises at least one of apolymer film, a metal foil, and a multilayer barrier film.
 28. A coolingsystem comprising an article according to claim
 25. 29. A computercomprising an article according to claim
 25. 30. A method of installingan article for cooling a heat-dissipating component comprising: affixinga body to a substrate supporting a heat-dissipating component, said bodycomprising at least one sidewall and a breachable seal cooperating todefine an enclosed volume, and a quantity of heat transfer fluiddisposed within said enclosed volume; and breaching said seal to allowsaid heat transfer fluid to contact said heat-dissipating component. 31.The method of claim 30 further comprising affixing a boiling enhancementto said heat-dissipating component.
 32. The method of claim 31 whereinsaid boiling enhancement is affixed to said heat-dissipating componentwith a thermal interface material comprising a eutectic alloy.
 33. Themethod of claim 31 wherein said boiling enhancement is soldered to atleast a portion of said heat-dissipating component.
 34. The method ofclaim 30 wherein said heat-dissipating component comprises an integratedcircuit.
 35. The method of claim 30 further comprising placing acondenser in fluid communication with said body.